Temperature Rise Studies on Electrical Equipment Current-carrying Patch Board
doi: 10.16516/j.gedi.issn2095-8676.2015.S1.015
- Received Date: 2015-11-01
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Key words:
- current-carrying fault /
- current-heating /
- current-carrying patch board /
- heat transfer /
- finite element approach /
- ANSYS simulation
Abstract: According to the relationship between the electrical equipment current-carrying fault and contact resistance, loaded-current, surface environmental temperature and board dimension,this paper study and set up high-voltage electrical equipment current-carrying patch board fault temperature rise fault finite element approach, by means of heat transfer theory, build temperature rise model. According to a 35 kV current transformer loaded-current patch board heating-fault, this paper analysis by the ANSYS simulation calculation way,and research focus on current-carrying temperature rais effect of current size, surface environmental temperature and board dimension. Analytic result has important references for the current-heating fault judgment of the electrical equipment, and has important references for the manufactures selecting board dimension on high-voltage electrical equipment.
Citation: | WU Dongwen, ZENG Han, WU Hua. Temperature Rise Studies on Electrical Equipment Current-carrying Patch Board[J]. SOUTHERN ENERGY CONSTRUCTION, 2015, 2(S1): 71-75. doi: 10.16516/j.gedi.issn2095-8676.2015.S1.015 |